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Description
The ULPP-257 laser is designed for micro-cutting, drilling and selective material removal for PCBs, flex circuits, LEDs and flat panel display applications. Exceptional IPG non-linear crystal robustness enables industry-leading laser reliability and stability of process parameters. The fiber-based architecture allows for an easy-to-integrate, compact, lightweight optical head tethered to a remote air-cooled module. The small, flexible form factor is ideal for material processing workstations utilized in the display, solar, electronics, medical device and other industries.
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