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Description
Swiss Synova Laser MicroJet (LMJ) is a hybrid method of machining, which combines a laser with a "hair-thin" water jet that precisely guides the laser beam by means of total internal reflection in a manner similar to conventional optical fibers. The water jet continually cools the cutting zone and efficiently removes debris.
Key Features of the Laser MicroJet (LMJ) Technology:
1. A proven solution for compound semiconductors, power devices, and dicing applications. 2. Achieves smooth cutting edges through laser guidance via a water jet. 3. The water jet provides continuous cooling, eliminating the formation of heat-affected zones (HAZ). 4. Capable of machining arbitrary shapes without the right-angle limitations of traditional mechanical tools. 5. Suitable for processing challenging materials such as SiC, ceramics, and diamond.
Key Features of the Laser MicroJet (LMJ) Technology:
1. A proven solution for compound semiconductors, power devices, and dicing applications. 2. Achieves smooth cutting edges through laser guidance via a water jet. 3. The water jet provides continuous cooling, eliminating the formation of heat-affected zones (HAZ). 4. Capable of machining arbitrary shapes without the right-angle limitations of traditional mechanical tools. 5. Suitable for processing challenging materials such as SiC, ceramics, and diamond.
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