Deep UV

ULPN-266 laser is designed for micro-cutting, drilling, texturing, marking and selective material removal on challenging materials such as glass, diamond and Teflon. Exceptional IPG non-linear crystal robustness enables industry-leading laser realiability and stability of process parameters. The pulse energy is nearly independent of pulse repetition rate, resulting in the highest productivity at the maximum average power. The fiber-based architecture allows for an easy-to-integrate, compact, lightweight optical head tethered to a remote air-cooled module. The small, flexible form factor is ideal for material processing workstations utilized in the display, electronics, medical device and other industries.

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