HI-NANO OPTOELECTRONICS CO.,LTD.

HI-NANO OPTOELECTRONICS CO.,LTD.

Advanced AR Lens Cutting、Glass cutting and hole drilling、TGV (Through Glass Vias) and Glass Core、Coated Lens Cutting、Sintered SiC Machining、SiC wafer dicing、Ceramic Micromachining、IC Vertical Probe Card、Laser Wafer Dicing、Diamond Laser Processing。